• System Inspection:  We perform intial in-depth inspection to screen for obvious anomalies or defects in the failing system.
• Failure Verification: Each reported failure mode is thoroughly reviewed and tested to validate its authenticity and reproducibility.
• Documentation Review: Our team analyzes all relevant manuals, datasheets, and technical resources to gain a deeper understanding of the failing system.

• System Teardown: We conduct targeted teardowns and follow that by inspection of the electronic and mechanical  subsystems.
• Electrcial Analysis: Utilizing various bench equipment we perform electrical test measurements at critical points within the system to identify  any abnormal signatures.
• Failure Site Identification: Our analytical process pinpoints suspect subsystems, components, or boards.

If our investigation leads to an individual PCBA board or subsystem, we continue with:

• Faulty Subsystem Replacement: If feasible, we replace the susptect subsystem, component, or board to verify the full return to functionality of the system and confirm that no other failure exists in the system.
• Optical and X-ray Inspection: Subsequently we conduct  targeted inspections of the subsystem or board, to screen for any obvious abnormalities or damage.
• PCBA Failure Analysis: A subsequent PCBA Failure Analysis is then carried out to  identify the physical and electrical failure mechanisms and root causes.

After completing our comprehensive analysis, we provide a detailed final report that contains all findings and insights. Moreover, this report serves as a valuable guide to help you understand the failure mechanisms and root cause and make informed decisions moving forward.